BGA Assembly Services In Illinois
At A2Z EMS, we specialize in delivering top-notch BGA assembly services for advanced PCB projects across Illinois. Ball Grid Array (BGA) technology is essential for creating compact, high-performance electronic products, and our expertise ensures every project meets the highest standards of precision and reliability.
Our modern facilities and skilled technicians are equipped to handle complex BGA assembly requirements, including fine-pitch soldering, X-ray inspection, and rework capabilities. Whether you’re developing prototypes or scaling up production, we provide the accuracy and consistency needed for optimal performance.
With A2Z EMS, you’re not just getting a service provider—you’re gaining a dedicated partner. We work closely with you throughout the process, offering tailored solutions to match your project’s specific requirements. Trust us to turn your advanced PCB designs into reality with precision-focused BGA assembly services that exceed expectations.
Our BGA Assembly Capabilities
BGA Components Placement
We specialize in accurately placing BGA components, ensuring reliable connections and optimal performance. Our advanced machinery and skilled technicians handle even the most intricate layouts precisely and consistently.
BGA Assembly Soldering Techniques
Our BGA solder techniques utilize cutting-edge equipment and expertise, ensuring durable, high-quality connections. We excel in handling fine-pitch soldering for complex assemblies, delivering unmatched reliability for advanced PCB designs.
Inspection Methods for BGA Assembly
Our advanced inspection methods, including X-ray analysis, identify any defects in BGA assembly. This ensures perfect alignment, strong connections, and high-quality results for every project we undertake.
Why Choose A2zems for BGA Assembly?
Choose A2Z EMS for BGA assembly to benefit from our precision, advanced technology such as surface mount & through hole , and commitment to delivering reliable, high-quality results tailored to your project’s unique needs.
Decades of Expertise
With decades of experience in BGA assembly, A2Z EMS combines industry knowledge, advanced techniques, and precision to handle complex projects, ensuring exceptional results for your high-performance PCBs.
End-To-End Solutions
A2Z EMS offers comprehensive BGA assembly services, from design to testing, ensuring seamless processes and high-quality results. Partner with us for complete, worry-free solutions to bring your ideas to life.
Quality Check at Every Step
We implement stringent quality checks throughout the BGA assembly process, guaranteeing precision, durability, and performance at every stage, so your products meet the highest industry standards.
Customer-Centric Solutions
We customize our BGA solutions to fit your unique needs perfectly. At A2Z EMS, we focus on understanding your requirements to deliver customized, reliable, and efficient solutions for every project.
Tech Sheet
Technology | Standard Technology | Advanced Technology |
|---|---|---|
Maximum Board Thickness | 5MM | 5.8MM |
Minimum Edge of panel to Component for single side panels
(Panel mostly like be V-scored) | 0.5MM | 0.4MM |
Minimum Edge of panel to Component for Double side panels
(Panel mostly like be V-scored) | 0.75MM | 0.5MM |
Component Lot/date code traceability process | all receiving is tracked under the ERP and saved in cloud | all receiving is tracked under the ERP and saved in cloud |
Lot Tracebility | Online portal, Muliple Manufacturing Lots with full tracebility to individual Mo thru the ERP. | Online portal, Muliple Manufacturing Lots with full tracebility to individual Mo thru the ERP. |
AOI Capability | 3D AOI with Spc Reporting | 3D AOI with Spc reporting |
Smallest pitch connectors Capability | 2.54MM | 1.52MM |
Shield-Shield Spacing requirement | 1.5 MM | 0.7 MM |
Minimum Component spacing from a part that selective soldering is used on | 10MM | 8MM |
Wave or Selective Solder | Tin Lead Wave, Lead free Wave and 5 selective machines | Tin Lead Wave, Lead free Wave and 5 selective machines |
Nitrogen Generator | Inhouse for selective Soldering | Inhouse for selective Soldering |
Maximum Panel Size | 12"X18"Length | 22"X18"Length |
Minimum Panel Size | 3"X3" length | 2.5"x 3" length |
Gallery
01
Land Grid Array
Land Grid Array packages offer a flat contact surface for easy soldering and reliable connections. Ideal for high-density PCBs, they provide excellent performance and durability for advanced applications.
02
Wafer Level Chip Scale
The Wafer Level Chip Scale Package offers a compact and efficient solution, perfect for applications where space is limited. It offers high performance and reduced assembly costs, making it perfect for modern, lightweight devices.
BGA Packages We Offer
At A2Z EMS, we provide a wide range of BGA package types to meet your project’s needs. We provide a range of options, including micro BGA, plastic BGA, and ceramic BGA, to suit your specific project needs.These types of BGA packages ensure compatibility with various applications, offering superior performance and reliability for advanced electronic designs.
04
Package on a Package
Package on Package technology stacks multiple ICs, maximizing functionality in minimal space. This innovative packaging method is ideal for devices requiring high performance in a compact design.
03
Quad Flat No-lead Package
The QFNLP package is a lead less design that minimizes footprint while maintaining excellent thermal and electrical performance, making it ideal for compact, high-performance electronic products.
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FAQ's
BGA (Ball Grid Array) assembly is the process of attaching BGA components to a printed circuit board (PCB) with precise and accurate soldering methods. At A2Z EMS, we specialize in delivering high-quality BGA assemblies for advanced electronic projects.
The quality of BGA assembly depends on precise soldering, accurate component placement, effective thermal profiling, and thorough inspection. A2Z EMS ensures these factors are carefully managed to deliver reliable and high-performing assemblies.
Yes, at A2Z EMS, we deliver fast BGA assembly services while ensuring top-notch quality every time. We prioritize efficiency and precision to meet tight deadlines for your projects.
Yes, A2Z EMS performs comprehensive design-for-manufacturability (DFM) tests to ensure your BGA assembly designs are optimized for seamless production and consistent performance. This proactive step reduces potential issues and improves efficiency.
We use advanced surface-mount technology (SMT), precise reflow soldering, and X-ray inspection to ensure accurate and reliable BGA assembly. Our tools help us handle even the most complex components with care.