Surface Mount Technology
We provide precise SMT solutions for seamless surface mount PCB assembly, ensuring accuracy, reliability, and efficiency in every project. Our advanced equipment and expert team handle intricate designs with care, delivering high-quality results that meet industry standards. Whether for prototypes or large-scale production, our SMT solutions are tailored to suit your unique requirements.
Surface Mount Technology is a method of assembling electronic components directly onto the surface of a PCB. This approach enables compact designs, improves efficiency, and enhances reliability, making it ideal for modern electronic manufacturing.
01005
Placement
Capable
100K
CPH
Capable
5+
Quality
Checks
The Surface Mount Assembly Process
PCB Preparation
The SMT assembly process begins with preparing the PCB, applying solder paste to designated areas to ensure proper component bonding.
Component Placement
Using precision equipment, components are carefully placed on the PCB according to the design specifications, ensuring accuracy and reliability.
Reflow Soldering
The PCB is heated in a reflow oven, melting the solder paste to create strong and secure connections for all components.
Technology | Standard Technology | Advanced Technology |
|---|---|---|
Minimum Panel Size | 3"X3" length | 2.5"x 3" length |
Maximum Panel Size | 12"X18"Length | 22"X18"Length |
Maximum Board Thickness | 5MM | 5.8MM |
Minimum Edge of panel to Component for single side panels
(Panel mostly like be V-scored) | 0.5MM | 0.4MM |
Minimum Edge of panel to Component for Double side panels
(Panel mostly like be V-scored) | 0.75MM | 0.5MM |
Screen Printer accuracy | 0.2MM | 0.08MM |
SMT Placement accuracy | 0.05MM | 0.025MM |
Smallest component package size | 01005 Imperial (0402 Metric) | 008004 Imperial |
Reflow Profile method and equipment | KIC PROFILER | KIC PROFILER |
SPI Capability | 3D SPI Inline with SPC reporting | 3D SPI Inline with SPC reporting |
Component Lot/date code traceability process | all receiving is tracked under the ERP and saved in cloud | all receiving is tracked under the ERP and saved in cloud |
Lot Tracebility | Online portal, Muliple Manufacturing Lots with full tracebility to individual Mo thru the ERP. | Online portal, Muliple Manufacturing Lots with full tracebility to individual Mo thru the ERP. |
AOI Capability | 3D AOI with Spc Reporting | 3D AOI with Spc reporting |
BGA/PoP Capability | Min-1MM X 1MM, Max-50MM X 50MM | Min-1MM X 1MM, Max-50MM X 50MM |
Smallest BGA pitch capaibility | 0.4 MM | 0.35MM |
Smallest pitch connectors Capability | 2.54MM | 1.52MM |
Smallest Pitch QFN Capability | 0.5MM | 0.4MM |
Smallest Pitch WLCSP Capability | 0.5MM | 0.4MM |
Tallest Component Capability | 6MM | 10MM |
Largest Component Capability | 2 Inch by machine | 6 Inch by machine |
Component to Component Spacing requirement | 20 mils | 12 mils |
Shield-Shield Spacing requirement | 1.5 MM | 0.7 MM |
Stencil Type used for designs with 0201 and 0.35 pitch BGA | 3 mils nano | 3 mils nano |
Minimum Stencil Webbing for Passive/fine pitch parts | 0.3MM | 0.25MM |
Minimum Paste area and aspect ratio capability | Minimum 0.7mils area with aspect ratio 1.55 mils | Minimum 0.7mils area with aspect ratio 1.55 mils |
Name Lastname
Name Subtitle
Use this space to share a testimonial quote about the business, its products or its services. Insert a quote from a real customer or client here to build trust and win over site visitors.
Name Lastname
Name Subtitle
Use this space to share a testimonial quote about the business, its products or its services. Insert a quote from a real customer or client here to build trust and win over site visitors.
Name Lastname
Name Subtitle
Use this space to share a testimonial quote about the business, its products or its services. Insert a quote from a real customer or client here to build trust and win over site visitors.
Gallery
01
Technical Expertise
Our team leverages deep technical knowledge to maximize the benefits of surface mount technology, delivering precise, efficient, and high-quality solutions tailored to meet your specific requirements.
02
Cutting-Edge Technology
We utilize advanced tools and processes to ensure every project benefits from the latest innovations in SMT, guaranteeing reliable and high-performance PCB assemblies.
03
Customer-Centric Approach
Your satisfaction is our priority. We collaborate closely with you to deliver solutions that align with your goals, ensuring quality, reliability, and a seamless experience from start to finish.
04
Fast Lead Times
We focus on efficiency, ensuring timely delivery while maintaining exceptional quality. Our streamlined processes ensure fast turnaround times to meet your production schedule.
Why A2Z EMS
We understand the advantages of surface mount technology and bring expert craftsmanship to every project. Our advanced equipment and skilled team ensure precision, efficiency, and reliability. By choosing us, you gain access to tailored solutions, superior quality control, and fast turnaround times to meet your electronic manufacturing needs.
05
Component Placement
We accurately place SMT components onto the PCB with various equipment, ensuring precise alignment and positioning.
06
Reflow Soldering
Our reflow SMT soldering process securely attaches components to the PCB. This process provides strong and reliable electrical connections.
07
Inspection and Testing
We conduct thorough inspection and testing to verify the quality and functionality of each assembled PCB. This way, we can meet all quality specifications and standards.
Tech Sheet
FAQ's
Surface Mount Technology is a method for constructing electronic circuits in which components are mounted or placed directly onto the surface of printed circuit boards (PCBs).
Surface Mount Technology is used in electronic manufacturing to produce smaller, lighter, and more efficient electronic devices. It is used in consumer electronics, telecommunications equipment, medical devices, and more.
There is a huge difference between SMT vs through hole technologies. SMT assembly involves mounting components directly onto the PCB surface. On the other hand, Through Hole Technology (THT) involves inserting components through holes drilled in the PCB and soldering them on the opposite side.
SMT assembly offers advantages such as increased component density, reduced size and weight of PCBs, automated assembly processes leading to higher production speeds, and better electrical performance due to shorter interconnection paths.
Surface Mount Device (SMD) refers to the individual electronic components mounted directly onto the PCB surface using SMT. Surface Mount Technology (SMT) refers to the overall method of assembly where components are mounted onto the PCB surface. Therefore, SMDs are the components used in SMT assembly processes.
Our Capabilities in SMT Assembly
We deliver precise, reliable, and high-quality Surface Mount Technology solutions for all your PCB assembly needs.
State-of-the-Art Equipment
We use advanced tools and machinery for surface mount technology, ensuring precision, efficiency, and top-notch results in every PCB assembly.
Quality Control
Our rigorous testing processes guarantee the highest standards of quality in surface mount technology, ensuring reliability and performance for every project.